- Career Center Home
- Search Jobs
- Engineer, Mechanical Simulation
Results
Job Details
Explore Location
Amkor Technology
Tempe, Arizona, United States
(hybrid)
Posted
30+ days ago
Amkor Technology
Tempe, Arizona, United States
(hybrid)
Job Duration
Indefinite
Industry
Semiconductor
Min Education
BA/BS/Undergraduate
Required Travel
None
Job Function
Other
Engineer, Mechanical Simulation
The insights provided are generated by AI and may contain inaccuracies. Please independently verify any critical information before relying on it.
Engineer, Mechanical Simulation
The insights provided are generated by AI and may contain inaccuracies. Please independently verify any critical information before relying on it.
Description
Amkor is recruiting for a Mechanical Simulation Engineer based in Tempe, AZ. The primary responsibility of this position is to perform mechanical finite element simulation analysis for semiconductor packaging to support product development for Amkor's internal and external customers. The applicant should have demonstrated knowledge and skills in performing mechanical simulation, running finite element model, analyzing model results, and communicating with customers.
Requirements
- Perform mechanical simulation such as stress simulation, warpage simulation, and reliability simulation for semiconductor IC package devices using Ansys finite element simulation tool.
- Work with customers, business units, and R&D to support simulation needs for new product development and introduction, design and material optimization. Provide mechanical and reliability solutions for advanced packaging technologies.
- Support factories with simulation to find root cause of product failure as well as correction options. Correlate the simulation results to the failure mechanism.
- Effectively communicate with internal and external customers. Provide world-class simulation services to our customers.
- Develop new simulation tools to improve productivity and efficiency. Develop new leading simulation technologies for mechanical and reliability challenges in next generation advanced IC packaging products.
QUALIFICATIONS:
- BS degree in Mechanical Engineering.
- Previous relevant experience with internship experience considered.
- Knowledge of mechanical finite element modeling and tools.
- Strong understanding of stress strain mechanics, failure mechanisms, reliability, thermal expansion.
- Proven understanding of material linear and nonlinear behaviors.
- Strong competence with problem analysis/solving.
- Effective and demonstrated verbal and written communication/presentation skills.
- Must have a customer service-oriented approach.
- Strong ability to work independently while supporting team work.
- Self-motivated with strong ability to manage time and drive schedules efficiently.
- MS degree is a plus.
- Demonstrated experience of doing finite element mechanical simulation and experience with simulation tools such as Ansys is desired.
- Knowledge of semiconductor devices, packaging, and materials used is a plus.
- Experience/knowledge with mechanical test, material property test, reliability test, and failure analysis is preferred.
- Demonstrated experience/knowledge of polymer or composite material behaviors, as well as non-linear viscoelastic, plastic, or creep effects is desired.
- Ability to work in a world-wide diverse work environment is preferred.
Job ID: 79110247
Please refer to the company's website or job descriptions to learn more about them.
View Full Profile
Jobs You May Like
Median Salary
Net Salary per month
$4,059
Median Apartment Rent in City Center
(1-3 Bedroom)
$1,900
-
$2,450
$2,175
Safety Index
58/100
58
Utilities
Basic
(Electricity, heating, cooling, water, garbage for 915 sq ft apartment)
$141
-
$500
$257
High-Speed Internet
$50
-
$130
$82
Transportation
Gasoline
(1 gallon)
$3.41
Taxi Ride
(1 mile)
$2.20
Data is collected and updated regularly using reputable sources, including corporate websites and governmental reporting institutions.
Loading...